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Samsung started manufacturing 3nm chipsets



Samsung started manufacturing 3nm chipsets

Samsung started manufacturing 3nm chipsets: Samsung recently revealed that it had begun manufacturing chipsets based on its 3nm process technology with GAA architecture. Still, TSMC has yet to adopt the 3nm architecture for the company’s chip production process.

Samsung has successfully surpassed the Taiwanese chipmaker by starting production and becoming the first semiconductor manufacturer to use the 3nm node. Details are provided here!

Samsung Starts 3nm Chipset Production

To herald the beginning of production of their 3nm process node with Gate-All-Around (GAA) design, Samsung recently issued a newsroom article. 

The Multi-Bridge Channel FET (MBCFET) GAA design, according to the manufacturer, “defies the performance restrictions of FinFET, boosting power efficiency by decreasing the supply voltage level, while simultaneously enhancing performance by increasing current drive capability.”

Compared to its prior 5nm technique, Samsung‘s new production method delivers a 45 percent increase in power efficiency, a 23 percent increase in performance, and a 16 percent decrease in chipset surface area. 

The company’s future goals include increasing performance by 30% while lowering size and power usage by 50% and 35%, respectively.

“Samsung has expanded quickly as we continue to show leadership in integrating next-generation technologies into production, including the first High-K Metal Gate in the foundry sector, FinFET, and EUV. 

With the MBCFET, the first 3nm process in history, we want to maintain our leadership position. Dr. Siyoung Choi, President and Head of the Foundry Business at Samsung, said, “We will retain active innovation in competitive technology development and construct methods that assist accelerate obtaining maturity of a technology.

According to Samsung, the current 3nm process technology’s first use is restricted to chipsets for high-performance, low-power computer systems. However, the business plans to use the same approach in the future when producing mobile chips.

Having adopted the cutting-edge 3nm technique for chip production first gives Samsung an advantage over its rival TSMC. 

Bloomberg claims that this won’t impact the latter’s market share or sales growth over the next 12 months unless Samsung can demonstrate that its 3nm process is just as cost-effective as TSMC’s cutting-edge N3 technology. 

If the Korean behemoth is successful, it may be able to get contract orders from Apple, Qualcomm, and other significant players in the market.

Furthermore, according to Bloomberg, Samsung would first produce the 3nm chipsets at its Hwaseong facility in Korea before extending production to Pyeongtaek. 

Additionally, it is said that the corporation is constructing a sizable chip factory in Texas that will eventually be able to manufacture 3nm chipsets. The manufacturing mentioned above won’t begin mass production until 2024.