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MediaTek Dimensity 1050 Is the Firm’s First mmWave 5G SoC



MediaTek Dimensity 1050 Is the Firm's First mmWave 5G SoC

Following the announcement of the Dimensity 8000 and 8100 5G SoCs earlier this year, MediaTek has now released the MediaTek Dimensity 1050, a new mobile chipset in its Dimensity 1000 family. 

It is the firm’s first mmWave 5G chipset to enable high-speed, dependable 5G internet. 

In addition, the business announced the Dimensity 930 and Helio G99 chipsets. Take a look at the information below.

MediaTek Dimensity 1050 Specifications

The Dimensity 1050 SoC from MediaTek is a 5G chipset built on TSMC’s 6nm architecture. It’s an octa-core CPU with two ARM Cortex-A78 cores running up to 2.5GHz each. 

It also includes an ARM Mali-G610 MC3 GPU and LPDDR5 RAM, and UFS 3.1 storage capabilities.

The Dimensity 1050 is the company’s first-ever 5G chipset, combining mmWave and Sub-6GHz 5G to give up to 53 per cent quicker 5G experience on smartphones than LTE + mmWave. 

For those unfamiliar, 5G mmWave runs at 6GHz or higher spectrum to provide consumers with the fastest 5G speeds.

However, despite its faster speeds, the 5G mmWave spectrum is less dependable than the Sub-6GHz band in terms of range and building penetration.

“The Dimensity 1050, with its mix of sub-6GHz and mmWave technologies, will enable end-to-end 5G experiences, continuous connection, and improved power efficiency to fulfil daily user needs,” said CH Chen MediaTek’s Deputy General Manager for Wireless Communications Business.

Apart from that, the Dimensity 1050 SoC supports the most recent Wi-Fi 6E and Bluetooth 5.2 technologies. It is equipped with MediaTek’s APU 550, promoting AI-assisted photography functions. 

The processor also supports MediaTek’s HyperEngine 5.0 gaming engine, up to 108MP cameras, and screens with a refresh rate of 144Hz, among other features.

Dimensity 930, Helio G99 Specifications

Apart from the Dimensity 1050 SoC, MediaTek has also announced the Dimensity 930 and Helio G99 chipsets. The Dimensity 930 SoC uses 2CC-CA technology combined with mixed duplex FDD+TDD to provide faster speeds and more coverage. 

According to the firm, the chipset supports MiraVision HDR video playback, HDR 10+, and displays with up to 120Hz refresh rates. It also helps MediaTek’s HyperEngine 3.0 Lite gaming engine, which provides reduced latency and longer battery life.

The new Helio G99 CPU provides a high-performance gaming experience on 4G networks, with more excellent throughput rates and up to 30% enhanced battery efficiency. 

It is the successor to the Helio G96 SoC and should be a good choice for low-cost gaming devices.

In terms of availability, smartphones based on the MediaTek 1050 and Helio G99 SoCs are expected to debut in the third quarter of 2022.

 Smartphones equipped with the Dimensity 930 will be available in Q2 2022. However, it is uncertain which OEMs will be the first to ship smartphones with the new MediaTek chipsets. 

So stay tuned for further information, and let us know what you think of the new Dimensity chipset in the comments section below.

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